Low-stress transfer bonding using floatation

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Low-stress transfer bonding using floatation

A novel method for transferring thin, large-area polymer layers from a mould and its subsequent bonding to a destination substrate is presented here. Buoyancy is used for transfer via floatation to allow the release of internal stress in the polymer and to avoid induced strain. Additionally, floatation leads to wrinkle-free contact between the polymer layer and its destination substrate, an imp...

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ژورنال

عنوان ژورنال: Journal of Micromechanics and Microengineering

سال: 2012

ISSN: 0960-1317,1361-6439

DOI: 10.1088/0960-1317/22/7/075005